The Defense Advanced Research Projects Agency (DARPA) has awarded the University of Texas at Austin's Texas Institute for Electronics (TIE) $840 million to establish a microelectronics manufacturing center for the Department of Defense, part of a $1.4 billion project. This investment aims to enhance national security by creating high-performance, compact defense systems using semiconductor technology. The initiative, focusing on 3D Heterogeneous Integration (3DHI), will enable the U.S. to advance its semiconductor industry and regain global leadership in microchip production. DARPA's efforts, including the Next-Generation Microelectronics Manufacturing program, align with a broader push to strengthen the domestic microelectronics industry and address technological challenges for both commercial and national security purposes.